US-based semiconductor packaging and test services provider Amkor Technology announced that its latest flip chip molded ball grid array (FCmBGA) packaging technology will be used by Altera Corporation in its 28-nm Arria V field programmable gate array (FPGA) products.
The new technology combines thermal performance of bare die FCBGA with a molded support surface around the die.
Altera's 28-nm product family leverages different packaging technologies and process technologies and features a variety of capabilities with a balance of cost and performance.
Altera senior director of component product marketing Patrick Dorsey said they needed a packaging technology to serve customers' low-power, high-performance and low-cost design requirements.
"Amkor's FCmBGA provides us the most optimized capabilities by offering high performance with a lower profile and better thermal coupling compared to alternative packaging solutions," added Dorsey.
Amkor's FCmBGA packages enable exposed die sizes up to 20mm without a lid requirement across the entire product sizes family and reduce package weight.